R. Glenn Robertson

7727 La Manga Drive(972) 960-2323

Dallas, Texas 75248glennr77@netscape.net

Objective

Technical Staff position where expertise in PC board assembly processes and manufacturability will contribute to rapid and cost-effective New Product Introduction.

Summary of Professional Skills

  Strong knowledge of soldering and all aspects  Familiar with Lead-free alloys used in

of SMT PCB Assembly technologyelectronics

  Familiar with PC bare board technology and with  Rework Processes

electronic component packaging Component Packaging Technology

  Strong writing and presentation skills SMT & Through-hole Connectors

  Experienced in liaison with purchasing, suppliers,

and other engineering departments

  General knowledge of optoelectronics and optical

components used in telecommunications systems

Professional Experience

NEW PRODUCT RESOURCE CENTER, Carrollton, Texas2001 - 2002

Senior Process Engineer

• Provided SMT process engineering support for a new Electronics Contract Manufacturing Company.
• Developed and documented new processes as required for PC board assembly operations.
• Evaluated and selected PCB assembly equipment.
• Ordered supplies, samples, and small equipment as needed to begin electronics manufacturing operations.
• Wrote proposals and pricing for customer projects.
• Performed failure analysis on customer boards using optical and X-ray inspection.
• Established company ESD policy and trained all employees on ESD prevention.

ALCATEL USA, Plano, Texas1999 - 2001

Senior Process Development Engineer

• Team member for development of new processes and materials as required for PCB assembly at five Alcatel USA manufacturing sites in Texas, North Carolina, and Mexico.
• Prepared test plans for SMT machine evaluations and wrote evaluation reports.
• Evaluated Automated Optical Inspection equipment for inspection of solder paste and components on PC boards.
• Advised New Product Introduction personnel on new PCB designs and component types.
• Instructor for 2-day SMT training class for Operations staff members and SMT line personnel. Provided assistance in development of an operator-level class.
• Resolved issues related to new and existing components by working with suppliers and other departments in Alcatel.
• Performed Failure Analysis for PC boards built internally and by Contract Manufacturers.
• Provided primary contact for Alcatel USA with the Alcatel Corporate Environmental Task Force and the High-Density Packaging User Group consortium.  Evaluated published information on Lead-free soldering for planning of future Alcatel processes and products.
• Selected to present paper on Lead-free soldering at Nepcon East 2000 trade show.

ALCATEL USA, Richardson, Texas1991 - 1999

SMT Process Development Engineer

• Assessed PCB and component technology to meet assembly requirements for current and future products.
• Selected equipment for new requirements such as BGA replacement.
• Lead teams for implementation of new PCB assembly processes, including no-clean Wave soldering, CFC elimination, BGA assembly, BGA rework, and through-hole reflow (pin-in-paste).
• Team member for implementation of compliant-pin connectors.  Team results were recognized with company quality award and profit-sharing bonuses.
• Advised development engineers on selection of components such as BGAs, sockets, and connectors.
• Supported Process Engineering department manager in various ways, including process documentation, planning of capital budgets, and resolution of process and component problems.

ROCKWELL INTERNATIONAL (now Alcatel USA), Richardson, Texas1989 - 1991

Hybrid Microelectronics Process Engineer

• Investigated materials and technology for potential use in future Multi-chip Module products.
• Developed and documented processes for metallization of through-holes in ceramic substrates.

ROCKWELL INTERNATIONAL (now Alcatel USA), Richardson, Texas1982 - 1989

Product Development Engineer

• Staff member in Development Engineering group responsible for implementation and industrialization of processes developed at the Rockwell Science Center.
• Primary products were optoelectronic components, including InP based laser diodes, and PIN photodetectors.
• Maintained full responsibility for justification, selection, installation, and maintenance (with one technician) of process development laboratory for optoelectronic components.

VARO ELECTRON DEVICES, Garland, Texas1980 - 1982

Process Engineer

• Developed processes for Gallium Arsenide thin-film photocathodes used in night vision equipment.
• Designed and assembled crystal growth equipment.
• Developed processes for sputtering of dielectric coatings.

Education

M.S. Materials Science, University of Texas at Arlington

B.S. Physics, Texas Christian University

Honors and Recognitions

• Author or co-author of six papers published in trade conference proceedings or magazines.
• Presented papers at technical programs for national trade conferences, and at local meetings.
• Member of Circuits Assembly magazine editorial board.
• One patent pending.