The addressed market of Rockwell Collins Printed Circuits (CPC) is primarily multi-layer boards 8-24 layers, low to medium volume; with technologies such as blind and buried vias, controlled impedance, copper invar copper and heatsink assemblies. The only exception is the RF/Microwave market requiring the use of Teflon, Duroid®, or TMM® substrates, as they will produce boards from 2-8 layers, low to high volume. Rockwell CPC is a qualified supplier of hi-rel boards to such specifications as UL-94V-0, MIL-P-55110 Types 1 2, MIL-STD-2000 and NASA NHB 5300. Experience in the use of various laminate materials includes FR-5, BT, polyimide, Teflon, Duroid®, TMM®, Cyanate Ester and Kevlar in addition to Standard FR-4 glass epoxy.

Like many circuit board operations, it was established to meet the company's need for circuit boards for aircraft avionics. But over the past 29 years, Collins Printed Circuits has become a leading independent supplier serving in excess of 225 customers.

Collins Printed Circuits is actively committed to continuous process improvement, with all personnel trained in the principles. Circuit board processes are precisely controlled through Statistical Process Control (SPC). They offer complete in-house electrical testing, at both high and low voltages. Monthly qualification testing is performed by their in-house mil-certified group testing lab.

World Class Manufacturing philosophies like Just In Time (JIT), Activity Based Accounting (ABC), and Computer Integrated Manufacturing (CIM) have been aided by the installation of a new software system by Cimnet called Paradigm. The integrated system provides MRP, CRP, SPC, ABC and shop floor information on a real-time access basis for analysis and action.

Collins Printed Circuits has been producing high-quality circuit boards for well over a quarter-century. Established reputation for quality and their financial strength is unsurpassed.

Please contact us at info@circuit-technology.com