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TTM Technologies, Inc.

                                                                     Time-To-Market Technologies TM

 

Redmond Division

 

Time-To-Market Printed Circuit Board Fabrication

Volume Printed Circuit Board Fabrication

 

About Redmond Division

                   Founded in 1978
                   Production/ramp-to-volume culture from beginning
                   Over 125,000 square feet of manufacturing space
                   2004 sales: $242,000,000; 2003 sales: $180,000,000
                   > 374 employees
                   Acquired by Thayer Capital and Brockway Moran in December 1998

               Ramp-to-Volume Capability/Capacity

                   Tens of thousands of SIMMs in 3-5 days
                   Hundreds of server boards in 5 days
                   10,000+ plug-in daughter cards in 5 days

 
            Volume Capacity/Capability

                   3000 panels-per-day capacity - expandable to over 4500 per day
                   18,000 inner-layer core capacity per day
                   24 x 30 panel size
                   3-10 day lead time for ramp-to-volume
                   3-4 weeks standard lead time

             48 Hour quick turn

              
Volume Technology-Memory

                   24 x 30 panel size
                   Rambus memory technology
                   In-house deep gold process (no tie bars)
                   Optically controlled auto-routing system
                   4/4 outer layer space and trace
                   Overall thickness tight tolerance

      
      Volume Technology-Networking

                   12:1 aspect ratio
                   30+ layers
                  .003/.00275" lines and spaces
                   Controlled/differential impedence
                   Volumes to over 3000/month per P/N
                   Double density, dual access testing
 

 


               RedmondDivision Capabilities

Parameter      Std Technology           Adv Technology

   §Thin Core                      0.004"                          0.0025"

   §Lines/Spaces(IL/OL)      0.004"/0.004"                 0.003"/0.003"

   §Via Holes/Pads             0.010"/0.020"                 0.008"/0.018"

   §Blind & Buried Vias      0.010"(Drilled)                0.008"(Drilled)

   §Aspect Ratio                 8:1                               12:1

   §Electrical Test              0.040" Pitch                   0.030" Pitch

 


                                            
             Redmond Division Surface Finishes

                   Electrolytic nickel gold
                   HASL
                   Selective tin-lead over nickel
                   Entek and Imadazole OSP

             Common Process/Systems

                   "Valor Genesis 2000" software
                   "Isola/Allied Signal/GETEK" laminate
                   "Shipley/Ronal" chemistry
                   "Orbotech" AOI
                   "Multi-Line" Post-Etch-Punch
                   "Taiyo" soldermasks

               Common Process Control

                   Microsections per RB-276 and IPC6012
                   Tru-Chem chemistry analysis software
                   Statistical process control, Cp and Cpk analysis
                   10,000-class clean rooms in image and lamination
                   Reliability testing, failure analysis

               Common Quality Assurance

                   All facilities certified to the ISO9002 system
                   All facilities re-audited every 6 months
                   All facilities IPC-A-600 Class I, II and III
                   All facilities Bellcore compliance

                   MIL-P-55110 certified

               Environmental Excellence

                   Self-monitored, State-accredited Laboratory   

 

 

Partial Customer List

 

3DFX Interactive

Apple Computer

Celestica

Cisco Systems

Compaq Computer

Ericsson

Hewlett Packard

IBM

Kingston

Kodak

Lucent Technologies

Motorola

Nortel Networks

SCI Systems

Solectron

 

 

Established in 1978

374 employees/125,000 sq. ft. facility

Please contact us at info@circuit-technology.com

 

   

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