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TTM Technologies, Inc.
Time-To-Market Technologies TM
Redmond Division
Time-To-Market Printed Circuit Board Fabrication
Volume Printed Circuit Board Fabrication
About Redmond Division
Founded in 1978
Production/ramp-to-volume culture from beginning
Over 125,000 square feet of manufacturing space
2004 sales: $242,000,000; 2003 sales: $180,000,000
>
374 employees
Acquired by Thayer Capital and Brockway Moran in December 1998
Ramp-to-Volume Capability/Capacity
Tens of thousands of SIMMs in 3-5 days
Hundreds of server boards in 5 days
10,000+ plug-in daughter cards in 5 days
Volume Capacity/Capability
3000 panels-per-day capacity - expandable to over 4500 per day
18,000 inner-layer core capacity per day 24 x 30 panel size
3-10 day lead time for ramp-to-volume 3-4 weeks standard lead time
48 Hour quick turn
Volume Technology-Memory
24 x 30 panel size
Rambus memory technology In-house deep gold process (no tie bars)
Optically controlled auto-routing system
4/4 outer layer space and trace Overall thickness tight tolerance
Volume Technology-Networking
12:1 aspect ratio
30+ layers .003/.00275" lines and spaces
Controlled/differential impedence Volumes to over 3000/month per P/N
Double density, dual access testing
RedmondDivision Capabilities
Parameter Std Technology Adv Technology
§Thin Core 0.004" 0.0025"
§Lines/Spaces(IL/OL) 0.004"/0.004" 0.003"/0.003"
§Via Holes/Pads 0.010"/0.020" 0.008"/0.018"
§Blind & Buried Vias 0.010"(Drilled) 0.008"(Drilled)
§Aspect Ratio 8:1 12:1
§Electrical Test 0.040" Pitch 0.030" Pitch
Redmond Division Surface Finishes
Electrolytic nickel gold
HASL Selective tin-lead over nickel
Entek and Imadazole OSP
Common Process/Systems
"Valor Genesis 2000" software
"Isola/Allied Signal/GETEK" laminate
"Shipley/Ronal" chemistry "Orbotech" AOI
"Multi-Line" Post-Etch-Punch "Taiyo" soldermasks
Common Process Control
Microsections per RB-276 and IPC6012
Tru-Chem chemistry analysis software
Statistical process control, Cp and Cpk analysis
10,000-class clean rooms in image and lamination
Reliability testing, failure analysis
Common Quality Assurance
All facilities certified to the ISO9002 system
All facilities re-audited every 6 months
All facilities IPC-A-600 Class I, II and III
All facilities Bellcore compliance
MIL-P-55110 certified
Environmental Excellence
Self-monitored, State-accredited Laboratory
Partial Customer List
3DFX Interactive
Apple Computer
Celestica
Cisco Systems
Compaq Computer
Ericsson
Hewlett Packard
IBM
Kingston
Kodak
Lucent Technologies
Motorola
Nortel Networks
SCI Systems
Solectron
Established in 1978
374
employees/125,000 sq. ft. facility
Please contact us at info@circuit-technology.com
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